PRECISION MANUFACTURING STARTS AT THE POINT OF CONTACT
powered by Gecomer® technology
Advanced Wafer &
Photonics Handling
Dry-adhesive gripping solutions for the precise, low-stress handling of wafers, micro-optics and sensitive photonic components.
High friction
High acceleration
Gentle release
Low-stress placement
Surface integrity
Protecting sensitive surfaces
Cleanroom & Vacuum
Semiconductor ready
TWO MARKETS. ONE POINT OF CONTACT.
Built for processes where contact matters.
When surfaces are sensitive, tolerances are tight and contamination must be controlled, the gripping interface becomes a critical process component.
INNOCISE develops microstructured gripping surfaces based on van der Waals interactions. They combine high lateral holding force with controlled, low-stress release.
SEMICONDUCTOR
Wafer handling
Microstructured gripping pads and carriers for precise wafer transfer, combining high shear force with minimized normal adhesion.
- Different silicon wafer types
- Warped-wafer handling solutions
- High acceleration & controlled release
- Cleanroom & vacuum environments
PHOTONICS
Component handling
Presice and clean handling of optoelectronic components, from manual assembly to automated production.
- Microlens & lens-array assembly
- Holding lenses in vacuum for PVD
- Ultra-high thermal stability up to 280 °C
- Fiber connector applications
ONE POINT OF CONTACT.
Built for processes where contact matters.
When surfaces are sensitive, tolerances are tight and contamination must be controlled, the gripping interface becomes a critical process component.
INNOCISE develops microstructured gripping surfaces based on van der Waals interactions. They combine high lateral holding force with controlled, low-stress release.
SEMICONDUCTOR
Wafer handling
Microstructured gripping pads and carriers for precise wafer transfer, combining high shear force with minimized normal adhesion.
- Different silicon wafer types
- Warped-wafer handling solutions
- High acceleration & controlled release
- Cleanroom & vacuum environments
PHOTONICS
Component handling
Presice and clean handling of optoelectronic components, from manual assembly to automated production.
- Microlens & lens-array assembly
- Holding lenses in vacuum for PVD
- Ultra-high thermal stability up to 280 °C
- Fiber connector applications
PRODUCT STRATEGY
Standardized Products. Customized Performance.
Select a topic to explore our product strategy.
Grip smarter. Move faster.
Validated Gecomer® pads for recurring wafer and micro-optic handling applications.
Built around your equipment
Adapt proven products to OEM-specific process and equipment requirements.
Optimize critical handling steps
Fine-tune contact surfaces, carrier concepts and release behavior for demanding applications
Develop tomorrow’s handling solutions
Collaborative development for future semiconductor, photonics and precision handling challenges.
WHY OEMs CHOOSE INNOCISE?
Engineered for the next generation of semiconductor and photonics manufacturing.
INNOCISE develops gripping surfaces, carriers and release concepts around the process requirements of semiconductor and photonics equipment.
Performance at speed
Stable transport at high acceleration.
Gentle on critical surfaces
Controlled release for sensitive substrates.
Designed for OEM platforms
Adapted to equipment requirements.
INSPIRED BY THE GECKO EFFECT
Powered by Gecomer® Technology
Gecomer® is a bio-inspired microstructured surface technology that creates adhesion through van der Waals interactions.
More than a gripping surface. From carrier design to release concepts, INNOCISE develops complete handling solutions for semiconductor and photonics equipment.
Organizations we have worked with
Partnering with semiconductor and photonics innovators to solve the next generation of wafer, micro-optics and precision handling challenges.
FAST PATH OF EVIDENCE
From sample to process concept
01
Define
Share component, surface, load, environment, cycle and release requirements.
02
Assess
An Initial Functional Test (IFT) determines whether a standard product fits or application-specific development is needed.
03
Validate
Evaluate gripping structure, carrier geometry and performance with representative parts.
04
Integrate
Move from pad to gripper, tool or automation concept for your production equipment.
Are you ready to get started?
What is your handling challenge?
Discuss your process requirements directly with our experts.